Babbitt | Metaverse Daily Must-Read: According to the report, Nvidia’s AI chip market share will be 75% in 2027, and TSMC confirms that it will spend 20.61 billion yuan to build an advanced packaging plant to meet the demand for AI chips

Abstract: According to the "Kechuangban Daily" report on July 25, Mizuho analyst Vijay Rakesh released a research report a few days ago, pointing out that as the demand for generative AI heats up, hardware suppliers that support large-scale language models and high computing requirements will usher in a lot of opportunities. It is estimated that Nvidia's AI-related revenue in 2027 is expected to reach 300 billion US dollars, and its AI server chip market will still account for 75%. According to news from IT House on July 25, TSMC officially confirmed today that it will spend NT$90 billion (approximately RMB 20.61 billion) to build an advanced packaging plant in response to the demand for advanced packaging such as AI chip CoWoS from manufacturers such as Nvidia and AMD.

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Mizuho: Nvidia’s AI-related revenue is expected to reach US$300 billion in 2027, and its AI server chip market share will be 75% by then

According to a report by "Kechuangban Daily" on July 25, Mizuho analyst Vijay Rakesh recently released a research report stating that Nvidia's AI-related revenue is expected to reach US$300 billion in 2027, and its AI server chip market share will still be 75%. According to the report, as the demand for generative AI heats up, hardware suppliers that support the high computational requirements of large language models (LLMs) will usher in a large number of opportunities, especially Nvidia. However, this does not mean that the market has closed the door to AMD. Rakesh predicts that by 2027, AMD will have around 5% of the AI server chip market.

TSMC will spend 20.61 billion yuan to build an advanced packaging plant to meet the demand for AI chips

According to news from IT House on July 25, TSMC officially confirmed today that it will spend NT$90 billion (approximately RMB 20.61 billion) to build an advanced packaging plant in Tongluo Township, Miaoli County, in response to the demand for advanced packaging such as AI chip CoWoS by Nvidia, AMD and other manufacturers. TSMC said this morning that the Hsinchu Science Park Authority has agreed to allocate 7 hectares of land. It is scheduled to complete the construction of the factory by the end of 2026 and mass production in the third quarter of 2027. This will be TSMC's sixth packaging production base after Longtan, Zhunan, and Nanke.

Zhiwei Intelligent Technology releases 140 billion parameters of Zhiwei Intelligent KDF large model

According to a report from IT House on July 25, Beijing Zhiwei Intelligent Technology Co., Ltd. recently released a large model of Zhiwei Intelligent KDF in Shanghai, as well as a series of products developed based on this model, including financial industry tools such as "KDF Zhixun", "KDF Absolutely", and "KDF Zhongshu".

It is reported that the training data of the Zhiwei Intelligent KDF large model is mainly in Chinese and contains a large amount of financial data to improve the model's ability to deal with problems in the business and financial fields. In addition, some English and code data are also integrated in the training data to adapt to the general ability of the model. During the training process, the Zhiwei Intelligent KDF large model treats a single Chinese character as an independent Token for processing. The number of model parameters reaches 140 billion, and the number of training tokens reaches 400 billion.

Duan Qinghua, CEO of Zhiwei Intelligent Technology, said that the limitations of existing general models in specific industries and Chinese capabilities are the main reasons for knowing not to choose from zero -training knowing unsomed KDF models. Chatglm is relatively weak in the application capabilities of specific industries. MOSS uses English models as the base and does not support Chinese. LLAMA training data is mostly English data. The literary ability is relatively weak. Therefore, the R & D team chose to train the unscrupulous KDF model from scratch to better improve its Chinese ability and industry applicability.

South Korea's cross-industry artificial intelligence alliance was launched, with members including leading companies such as Hyundai Motor and LG Electronics

According to the Korea Herald, on July 25, the Ministry of Trade, Industry and Energy of South Korea stated that a group of leading companies in 10 major industries in South Korea, including automobiles, shipbuilding, batteries, robotics and steel, agreed to establish an artificial intelligence alliance to use the latest AI technology to establish connections and cooperate in cross-industry value chains, thereby enhancing competitiveness.

It is reported that the Industrial AI Alliance is composed of the Ministry of Trade, Industry and Energy, public organizations and more than 400 domestic enterprises including 20 large companies. Industry representatives include Hyundai Motor Group, LG Electronics, Hyundai Steel, LG Energy Solutions, Samsung SDS and SK C&C. To enable the rapid adoption of AI technologies across industries, the consortium will operate through three technical subcommittees: mobility, mechanics and optimization. The coalition will also operate through two policy subcommittees, one for industry data and one for laws and regulations.

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"Intel launches 34 open source AI kits, developers are expected to embark on the "fast lane""

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